Hewlett Packard Vacancies Jun 2026 - Hewlett Packard give a chance to apply Jawatan Kosong Manufacturing Engineer Wirebond, that will be placed in Simpang Ampat. You will receive a better prospect as well as safer dwell later on. Joining to this firm makes a people able to carry out the purpose less complicated and make current aspiration come true.

To help this corporation perspective along with mission come on legitimate Hewlett Packard will be wide open on fresh placement since Januari 2025. Everybody who are enthusiastic filling this particular vacant, please take a part in this Jawatan Kosong Manufacturing Engineer Wirebond recruitment. If you are one which can certainly load qualifications, you can try to see more info about Jawatan Kosong Manufacturing Engineer Wirebond below.

Hewlett Packard Job Vacancies Jun 2026

IHA Wirebond Process Engineer

Applies developed subject matter knowledge to solve common and complex business issues within established guidelines and recommends appropriate alternatives. Works on problems of diverse complexity and scope. May act as a team or project leader providing direction to team activities and facilitates information validation and team decision making process. Exercises independent judgment within generally defined policies and practices to identify and select a solution. Ability to handle most unique situations. May seek advice in order to make decisions on complex business issues.

Responsibilities

• Well experienced in wirebond machine and responsible for product characterization and qualification of changes and well experienced in performing evaluations. Preferable with KNS machine experience.
• Designs engineering solutions, including methods, operation sequences, and processes for the manufacturing of parts, component sub-assemblies, and final assemblies, based on established engineering principles and in accordance with general specifications and requirements.
• Develops and implement cost estimates, capacity models, time standards, production area layouts, and recommendations for tooling and process requirements for new product introductions.
• Collaborates and communicates with management, internal, and outsourced manufacturing, development partners, cross-department regarding process and standards compliance, recording and reporting issues, and recommendations for problem resolution for the manufacture of existing products.
• Leads a project team of other manufacturing engineers and internal and outsourced manufacturing partners to develop and execute reliable, cost effective, high-quality technical manufacturing solutions and bonding profile optimization for moderately-complex products from new- product introduction through end of lifecycle and work in competitive environment.
• Represents the manufacturing engineering team for all phases of larger and more- complex development and manufacturing projects.
• Provides guidance and mentoring to less- experienced staff members.

Education And Experience Required

• Bachelor's or Master's degree in a technology or manufacturing-related engineering discipline or equivalent.
• Typically 4-6 years’ experience

Knowledge And Skills

• Using engineering tools and software packages to design and automate manufacturing processes.
• Strong analytical and problem-solving skills.
• Understanding of material properties and hardware and electrical component design.
• Using empirical analysis, modeling and methodologies to validate manufacturing process and tooling design and specifications.
• Excellent written and verbal communication skills; mastery of English and local language.
• Ability to effectively communicate manufacturing plans, proposals, and results, and negotiate options at management levels.

Sustainable impact is HP’s commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision – to create technology that makes life better for everyone, everywhere.

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As one of the leading companies in Malaysia, Hewlett Packard offers variety of opportunities for employees to grow and make them as future leaders of the professional and disciplined. Hewlett Packard also gives a dynamic work environment in order to encourage employees to give optimally, and at the same time, you are able to increase new experience and knowledge through the company programs.

If You are interested to send an application for Jawatan Kosong Manufacturing Engineer Wirebond Simpang Ampat Januari 2025 by Hewlett Packard, please prepare requirements files and documents as soon as possible. To apply by online, please click the "Apply" button below. If you still do not satisfy with a job recruitment above, you can try to read more jobs list in Simpang Ampat region from another company below.

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